We Work
To Understand
Your Project Goals and Outputs
To Understand
Your Project Goals and Outputs
Precision Microchannel Liquid Cooling Plate Manufacturer: Full-Process Capability from Prototype to Mass Production
Equipped with full in‑house capabilities spanning microchannel fabrication, vacuum brazing, and thermal testing — covering the complete workflow from cold plate fabrication to performance validation. Designed to handle thermal loads of 1,000–2,500 W per cold plate for high‑power AI chips and computing modules. Available in aluminum and copper configurations. We support the transition from prototyping to mass production ramp-up within 10 days. Process parameters are fully controllable throughout the entire production chain, and thermal resistance and helium leak test data are traceable, which shortens the validation cycle and reduces implementation risks.
Cross-Platform Compatibility: Process-Driven Thermal Solutions for Diverse AI Computing Chip
With end-to-end manufacturing capabilities encompassing precision molding, connection and sealing, and performance validation, we support diverse AI computing power cooling architectures. Our solutions cover applications including high-power-density GPUs, custom domestic AI chips, and modular ASICs for cloud service providers. We support irregular-shaped flow channels and multi-interface compatibility, offer mass production and delivery of aluminum- and copper-based cold plates, and possess technical expertise in composite materials.
Walmate AI and supercomputing
liquid cooling solutions
liquid cooling solutions
High-Power Cold Plate Prototyping Experience
Delivered cold plate prototypes for 1000W–2500W AI chips in collaboration with industry-leading customers. Proficient in the complete process from blueprint to prototype delivery, ensuring seamless project execution and on-time delivery.
Aluminum & Copper Solutions Portfolio
Standard aluminum-based solutions—lightweight and cost-optimized—for mainstream thermal requirements, plus copper-based high-performance options with ultra-low thermal resistance for demanding power densities. Configurable to match diverse thermal architectures.
Complete Thermal Resistance & Helium Leak Test Data
At the prototype stage, we deliver complete test reports covering thermal resistance validation and helium mass spectrometry leak detection. Fully reproducible data and audit-ready technical documentation for SQE review.
Rapid Change Request Assessment
Cold plate flow channels evolve with each chip iteration. Upon receiving engineering changes, we rapidly evaluate process feasibility and adjust processing plans—shortening prototype lead times without compromising quality.
Process Parameter Database & Traceability
Critical process parameters are systematically captured during prototype validation to establish fully traceable technical archives. This data repository directly informs mass production process windows, eliminating redundant verification and accelerating production ramp-up.
Working Principle
of Liquid Cooled Server
of Liquid Cooled Server
Cold Plate Liquid Cooling: The Mainstream Solution
Microchannel Liquid Cooling Plate solutions with a thermal capacity of 1000W–2500W for AI chip cooling. One-stop solution capabilities spanning microchannel machining, vacuum brazing, and thermal validation. Proven track record of prototype validation with industry-leading customers.
Immersion & Phase-Change: The Next Frontier
Immersion cooling achieves PUE below 1.08; phase-change cooling delivers enhanced heat dissipation for localized hotspots. Active R&D in fluorinated-fluid-compatible coating materials and chamber architecture.Open to joint pre‑development programs with customers, sharing development costs.
Products and Services
Thermal Modules
Liquid Cooling Accessories
Design Collaboration
Testing & Validation
Application Cases and
Success Stories
Success Stories
