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High power consumption and high density are the future of data centers. Liquid cooling will become the mainstream cooling solution for AI servers.
With the commercialization of AIGC products such as large models, the demand for AI servers will rapidly increase, with a large number of high-power CPU and GPU chips driving up the power consumption of the entire AI server.
In terms of CPU, as the number of cores increases, processor performance continues to improve, driving the continuous increase in processor power. In special scenarios (such as high-performance cloud computing), processors will use overclocking to improve computational performance and further increase power consumption.
In terms of GPU, some of the latest products can consume up to 700W of power, which exceeds the cooling capacity of traditional air-cooled systems.
In the future, the computing power density of AI clusters is generally expected to reach 20-50kW/cabinet, while natural air cooling technology generally only supports 8-10kW. Micro modules with cold and hot air duct isolation and water cooled air conditioning horizontal cooling will significantly reduce the cost-effectiveness after the cabinet power exceeds 15kW, and the ability and economic advantages of liquid cooling cooling solutions will gradually become prominent.
The coolant circulates through the pipeline under the drive of the pump. When the coolant flows through the heat exchanger inside the server, it exchanges heat with high-temperature components (such as CPU, GPU, etc.) to take away the heat.
The coolant dissipates heat into the environment through the radiator, maintaining a low temperature state, thereby achieving continuous and stable operation of the server.